Abstract
The thermal fatigue properties of the solder joints with various underfills were evaluated by thermal shock test. The thermal fatigue crack initiated at the bottom edges of interface between the (Ni,Cu) 3Sn 4 intermetallic compounds layer and the Ni 3P layer and spread to all the interfaces with increasing number of thermal shock cycles. The thermal fatigue properties of package with underfill, which has the higher glass-transition temperature ( T g) and lower coefficient of thermal expansion (CTE) were better than those of the package with underfill having the lower T g and higher CTE value.
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