Abstract
The thermal fatigue properties of the solder joints with various underfills were evaluated by thermal shock test. Flip chip package with electroless nickel-immersion gold plated on Cu pad of FR-4 substrate and the Sn-37Pb solder ball was used. The thermal fatigue crack initiated at the edges of interface between solder and silicon die. The fatigue property of package with underfill, which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion (CTE) value was better than that of package with underfill having a lower Tg and higher CTE.
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