Thermal effect on the transient behavior of a piezomagnetic half-space subjected to dynamic anti-plane load

Abstract

Considering the importance of understanding the propagation of transient waves in the piezomagnetic solids, the thermal effect on the transient behavior of a piezomagnetic half-space subjected to dynamic anti-plane load is investigated analytically in this paper. Using one-sided, two-sided Laplace transformation and Cagniard–de Hoop (CH) technique, an efficient and accurate analytical derivation for the solution of the anti-plane displacement, shear stress, magnetic potential, and induction in Laplace domain is presented. The study shows that the thermal stresses developed in x-axis and y-axis directions have significant influence on the transient response of the half-space. The magnetic induction B x increases obviously when the thermal stress is applied in x-axis direction, while it decreases when the thermal stress is applied in y-axis direction. Approaching time of magnetic induction B x and B y will become longer with higher thermal stress in x-axis direction. With the growth of the thermal stress in x-direction, contribution from the electromagnetic–elastic head (EH) wave increases, while the contribution from the shear elastic (SE) wave and the static value of shear stress decrease.