Abstract
A methodology was developed and implemented to optimize the design layout for i_ntegrated p_ower e_lectronics m_odules (IPEMs) by considering both the electrical and thermal performances. This paper is primarily focused on the thermal aspects, which were analyzed using three-dimensional (3D) computational software tools. Implementation of the design methodology resulted in a 70 percent reduction in the common mode current, a 4 percent reduction in the size of the geometric footprint, and a 7°C reduction in the maximum temperature rise for the case studied, thus, providing an increase in the IPEM’s overall performance.
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