Abstract
PurposeThe purpose of this paper is to study the drop reliability of ball-grid array (BGA) solder joints affected by thermal cycling.Design/methodology/approachThe drop test was made with the two kinds of chip samples with the thermal cycling or not. Then, the dyeing process was taken by these samples. Finally, through observing the metallographic analysis results, the conclusions could be found.FindingsIt is observed that the solder joint cracks which were only subjected to drop loads without thermal cycling appeared near the BGA package pads. The solder joint cracks which were subjected to drop loads with thermal cycling appear near the printed circuit board pads.Originality/valueThis paper obtains the solder joint cracks picture with drop test under the thermal cycling.
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