Thermal co-simulation of coaxial RF window and connector of a TWT

Abstract

Thermal co-simulation of coaxial output couplers (including the coaxial RF window and the RF connector) of a medium power CW helix TWT has been carried out using CST Microwave Studio and thermal solver of the CST Studio Suite. The RF losses as obtained from the frequency domain analysis are used in the co-simulation and the temperature profile of the window and the connector has been analyzed using suitable thermal boundaries and actual material properties. The co-simulation could be used for optimizing the design of a coupler with a considered decision on the thermal management.