Abstract
The unenhanced thermal performance of 20 mm Tape Carrier Packages (TCP) packages on 8 layer boards with internal planes is 19/spl deg/C/W. Package thermal resistance /spl Theta//sub jc/ has been measured at 2/spl deg/C/W. Simple PCB enhancements such as the addition of thermal vias, alone or with the use of low profile heat sinks, brings the thermal performance in line with requirements for mobile computing platforms which do not have forced convection cooling options available. With forced convection cooling, devices with power dissipation requirement of 5/spl deg/C/W and higher can be packaged in TCP format.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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