Abstract
Abstract A thermosyphonic cooling module (TSCM) has been designed, fabricated and tested to cool the multi-chip plugged into a planar packaging system. The cooling module consists of a cold plate and an integrated condenser. With an allowable temperature rise of 56 °C on the surface of the heater, the cooling module TSCM can handle a heat flux about 2.7 W/cm2. The transient characteristics of the cooling module have proved to be excellent; that is, when a heat load is applied to the system, steady state can be achieved within 10 ∼ 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser and ambient as well as the condenser temperatures affect the system performance.
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