Abstract
Post curing of electrically conductive adhesives (silver filled epoxy) by heating at an elevated temperature significantly enhances the thermal and mechanical stability of conductive adhesive joints. The contact electrical resistivity and thickness of a joint with epoxy or silicone based adhesive tend to decrease cycle to cycle upon thermal cycling between 30°C and 50°C and upon compression (up to 0.55 MPa), except for the silicone joint in the absence of compression. The effect of compression is significant in epoxy joint without post curing and in silicone joint, but is insignificant in epoxy joint after post curing, The effect of thermal cycling is significant in epoxy joint without post curing, less significant in silicone joint, and insignificant in epoxy joint after post curing.
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