Electrothermomechanical analysis and its application to studying electrically conductive adhesive joints

Abstract

Electrothermomechanical analysis (ETMA) is effective for studying electrically conductive adhesive joints. Post curing of an electrically conductive adhesive (silver particle filled epoxy) by heating at an elevated temperature significantly enhances the thermal and mechanical stability of the conductive adhesive joint. The contact electrical resistivity and thickness of a joint tend to decrease cycle to cycle upon thermal cycling between 30 and 50°C and upon compression (up to 0.55 MPa). The effects of compression and thermal cycling are significant in the joint without post curing, but is insignificant after post curing.