Thermal and Adhesion Properties of Fluorosilicone Adhesives Following Incorporation of Magnesium Oxide and Boron Nitride of Different Sizes and Shapes.

Kyung-Soo Sung,Min-Keun Oh,Namil Kim,So-Yeon Kim

doi:10.3390/polym14020258

Abstract

Thermally conductive adhesives were prepared by incorporating magnesium oxide (MgO) and boron nitride (BN) into fluorosilicone resins. The effects of filler type, size, and shape on thermal conductivity and adhesion properties were analyzed. Higher thermal conductivity was achieved when larger fillers were used, but smaller ones were advantageous in terms of adhesion strength. Bimodal adhesives containing spherical MgOs with an average particle size of 120 μm and 90 μm exhibited the highest conductivity value of up to 1.82 W/mK. Filler shape was also important to improve the thermal conductivity as the filler type increased. Trimodal adhesives revealed high adhesion strength compared to unimodal and bimodal adhesives, which remained high after aging at 85 °C and 85% relative humidity for 168 h. It was found that the thermal and adhesion properties of fluorosilicone composites were strongly affected by the packing efficiency and interfacial resistance of the particles.

Highlights

Polymers 2022, 14, 258. https://As electronic devices become increasingly smaller and more highly integrated, effective heat dissipation in microelectronic packaging has become a critical issue to ensure their reliability [1,2,3]
The thermal property of epoxy, silicone, and fluorosilicone resins was estimated by investigating adhesion strength at 23 ◦ C, 180 ◦ C, and 250 ◦ C
When the measurement was conducted at 180 ◦ C, the adhesion strength of epoxy decreased drastically to 34.2 kgf/cm2, while the silicone and fluorosilcone maintained their initial strength at 23 ◦ C

Summary

Introduction

Polymers 2022, 14, 258. https://As electronic devices become increasingly smaller and more highly integrated, effective heat dissipation in microelectronic packaging has become a critical issue to ensure their reliability [1,2,3]. Epoxy resins have been widely used as adhesives and coating solutions because of their excellent adhesion strength, low shrinkage, and ease of curing [7,8,9,10] They intrinsically possess poor fracture resistance due to limited flexibility and low thermal stability. The unique properties of heat resistance, low-temperature flexibility, and chemical resistance make them suitable for high-value products in the electronics industry [17,18,19].

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Results

Conclusion