Thermal analysis of starch for realizing embedded channel in low temperature co-fired ceramic

Abstract

The rapidly developing biotechnology, automotive industry, chemical and environmental fields have increasing needs for analytical systems with desires such as smaller sizes, lower sample volumes. Reduction in size results in further requirements in functionalities such as multi-sensor devices with low cost. These microsystems usually contain three-dimensional structures. In the fabrication of microfluidic devices ensuring a well-shaped channel is a challenge. During firing of the low temperature co-fired ceramic (LTCC) substrate, these embedded structures tend to deform and sag because the green glass–ceramic material is very weak. Starch was used as sacrificial volume material (SVM) to support the embedded structures of the LTCC during lamination and sintering. As a consequence of burnout, the increased fraction of evolving gases from SVM requires an adequate adaptation of the firing process to control starch degradation and provide a residue-free burnout. Using thermal analysis techniques and describing degradation kinetics of SVM, a new heating profile is demonstrated which insures complete starch burnout without damaging the LTCC structures.