Thermal Analysis of Microchannels Heat Sink using Super-hydrophobic Surface

Abstract

Abstract: Electronics devices are the major part of modern technology and with the rapid growth of miniaturizations of electronic devices, the heat dissipation from these devices have been the objective for researchers. This heat dissipation has to done effectively otherwise this will affect the life of device and will result decrement in efficiency. Increasing the heat transfer rates from electronic devices has long been a quest. Microchannel heat sink is one of the best option for removing heat from the electronics devices due to its compact size which provides high surface area to volume ratio that enables higher heat transfer rates. Microchannels are the flow passages having hydraulic diameter ranges from 10 micrometer (µm) to 200µm. Microchannel heat sink enhances the feasibility of electronics device. Microchannels with hydrophobic surface are a promising candidate for cooling of electronics devices, as hydrophobic surface can be used to create friction free regions with a channel which effectively reduce pumping power, flow pressure drop and frictional factor compared to Microchannel without Hydrophobic surface. This paper deals with the detailed behavior of Microchannel with hydrophobic surface. In this work, rectangular cross section with 0.8 mm (800 micron) hydraulic diameter super hydrophobic microchannel is used. Keywords: Microchannel, Hydrophobic surface, Heat transfer rate, Frictional factor.