Abstract
The advancement of miniaturization and high-density manufacturing of electronic devices necessitates lightweight and high-performance heat dissipation components. As a result, traditional coolants and cooling technologies are rapidly unable to satisfy the ever conditioning problems and requirements of specific high temperature generated electronic devices. A microchannel heat sink (MCHS) has been extensively researched and commonly used in electronics cooling as a novel system that is highly suitable for applications with high power and small heat dissipation space. This research presents a mathematical model focused on dimension analysis to determine the heat transfer coefficient of a microchannel heat sink in electronics cooling. Buckingham Pi (π)theorem with dimensional analysis was used to determine a functional correlation between the heat transfer coefficient and independent variables. Independent variables comprise; thermal conductivity (copper MCHS), hydraulic diameter (MCHS), length (MCHS), a mass flow rate of nanofluid, the density of nanofluid, inlet temperature of nanofluid, heat flux, % by volume concentration of nanoparticle and thermal conductivity of nanofluid. The established relationship between dependent and independent variables concerning various operating conditions is helpful for analyzing behaviour.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
