Thermal Analysis of MCM Packaging

A Andonova

doi:10.5755/j01.eee.20.5.7110

Abstract

This paper describes the use of infra-red thermography for the thermal study in the development stage of custom enclosures for multi-chip modules. Some limitations of conventional thermographic measurements are discussed and an approach for enhancing its application to quality control and diagnostics of faulty multi-chip module packages is proposed. The results from thermal measurements of radio-frequency range multi-chip module prototype in an open and a closed Quad Flat No Lead package are presented. DOI: http://dx.doi.org/10.5755/j01.eee.20.5.7110

Highlights

Thermal problems of the modern packaging methods pose a huge challenge in making decisions during thermal design process [1].The use of new solutions in packaging is linked to amendment and improvement of technology processes
The aim of this paper is to show the advantages of Infra-Red Thermography (IRT) in studying heat removal from the Quad Flat No Leads (QFN) packaging prototypes of specialized RF Multi-Chip Modules (MCMs)
The presented paper shows how an examination of the temperature distribution of the prototypes of packaged and unpackaged MCMs can be performed for thermal management purposes by using IRT system

Summary

Introduction

Thermal problems of the modern packaging methods pose a huge challenge in making decisions during thermal design process [1]. The use of new solutions in packaging is linked to amendment and improvement of technology processes. New mechanisms of failures can arise and it is necessary to develop diagnostic techniques and to introduce new criteria for assessing the reliability which are directly related to thermal phenomena in microelectronic devices. Some of the typical representatives of modern packaging methods are the Multi-Chip Modules (MCMs). The thermal management of MCMs poses a challenge to package manufacturing. The complexity of the problem and the nature of the solution techniques have created high degree of uncertainty in the results. High operating temperatures can reduce the RF (radiofrequency range) MCM performance [3], [4]

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Conclusion