Abstract
This paper presents a method for thermal simulation of electronic circuits using an analytical solution of the three-dimensional heat equation resulting from an appropriate circuit thermal model. The temperature fields in multilayered structures are computed analytically employing the Green's functions solution method. The entire solution methodology is illustrated in detail on the particular examples of electronic circuits containing multiple heat sources. Compared to the previous papers published by the authors, the method has been extended by including the possibility of simulating imperfect layer contacts. The simulation results are validated with infra-red measurements and results obtained using other methods. Additionally, the discussion of simulation errors caused mainly by different non-linear phenomena is included.
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