Abstract
The paper presents an original method for electronic circuit thermal simulation. The method, employing the Green's functions, is based on an analytical solution of the heat equation resulting from the circuit thermal model. The method is illustrated on the particular example of a hybrid circuit containing several heat sources. Compared to the previous publications by the authors, the method has been extended introducing the possibility of simulating imperfect layer contacts. The simulations are compared with infrared measurements and simulation results obtained using other methods
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