Abstract
In order to understand the thermal effect of the defects in 3D-TSV interconnection structure, corresponding finite element models were established and thermal-electronic analysis was conducted. The temperature distributions of different layers of TSV structure with defects were investigated and the distribution variations due to the three common types of interior defects, which were filling missing, axial cavity and end cavity, were analysed respectively. The simulation results of defect-free TSV were also given for the sake of comparison. From the results, it was clear that all kinds of defects caused obvious variations of temperature distribution. And TSV with the filling missing problem had the most recognisable temperature distribution difference among those three typical defects. The defect of end cavity, followed by axial cavity, had less effect. Based on these conclusion, the temperature distribution supported important defect information by which the interior defect inspection and recognition could be realized.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IOP Conference Series: Materials Science and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
