Thermal analysis of CPU with CCC and copper base plate heat sinks using CFD

Abstract

AbstractThis paper describes experimental and theoretical investigations of heat sinks with different base plate material mounted on CPUs. The thermal model of the computer system with heat sinks which is created using Gambit (for preprocessing) and the simulation is carried out using Fluent (for solver execution and post processing). The following parameters are considered: fin thickness, fin height, and number of fins. Primarily in this paper different base plate thickness and base plate materials are optimized for maintaining the cost and thermal performance of a heat sink. In this research work, the thermal model of the computer system with a slot parallel plate fin heat sink design has been selected, and the fluid flow and thermal flow characteristics of heat sinks are studied. The slot parallel plate fin heat sinks have been used with copper base plates and carbon carbon composite (CCC) base plates to enhance the heat dissipation. The results and conclusion obtained in this present work are found to be in good agreement with numerical results. A complete computer chassis with slot parallel plate heat sinks is investigated varying the thickness of base plate, and the performances of the heat sinks are compared. © 2011 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley Online Library (wileyonlinelibrary.com/journal/htj). DOI 10.1002/htj.20342