Thermal analysis for SSPC based on a novel hybrid cooling design embedded with automatic access of PCM under different currents

Abstract

In this work, a novel series thermal design scheme based on an automatic control hybrid cooling system is proposed for sudden high-current thermal shocks on SSPC (Solid State Power Controller) modules under steady-state operation. Since the hybrid cooling system combines the liquid cooling (LC) layer and PCM layer through the costal columns, it is called LC - PCM hybrid cooling system, providing the cooperation scheme of active and passive cooling to cool the high heating area of SSPC effectively when subjected to high current impacts. The thermal management behavior of the hybrid cooling system is compared numerically with that of employing LC for three thermal management strategies, including pure liquid cooling under one-time current (1C), triggered PCM hybrid cooling under twice the current (2C), and complete PCM hybrid cooling under triple the current (3C). The conclusions indicate that with the automatic and sequential access of PCM under 2C and 3C, using a hybrid cooling system leads to a reduction in Tmax rise by 21.8% and 18.1%, respectively. Moreover, the maximum temperature difference of each chip decreases by 4.4 K under the impact of 3C. Furthermore, some key operation conditions on the thermal control performance are also discussed. The costal columns play a crucial role in the integrated hybrid cooling system with PCM automatic access, enabling the cooling system to activate and regulate automatically under different currents.