Thermal analysis and package optimization for the multi-wavelength laser bar module

Abstract

To meet the demand of the laser application market for semiconductor laser function diversification, this paper proposes a handheld multi-wavelength laser stack packaging module. The 808 nm, 915 nm, and 980 nm semiconductor laser bars are selected for the integrated assembly of the multi-wavelength module. However, with the continuous increase of the optical power density of the integrated packaging module, thermal management has become a key factor affecting the performance and life of the device. In this paper, the finite element analysis method is used to analyze the influence of the arrangement of three laser stripe chips in the stacked packaging structure on the heat dissipation of the multi-wavelength module. The simulation results show that the heat dissipation efficiency of the multi-wavelength module can be improved by 13.74 % by changing the arrangement of chips. A back heat dissipation packaging structure with higher heat dissipation efficiency is proposed, and the influence of chip arrangement and working mode on the thermal characteristics of the device in the new packaging structure is simulated and analyzed. According to the simulation results, a chip arrangement that can make the heat dissipation effect of the multi-wavelength module achieve the best is determined.