Abstract
The role of interfacial defects in determining the band offset at silicon-oxide/silicon interfaces is studied using the first-principles band-offset evaluation method. The calculations are based on the cristobalite Si(100) interface model. The results show that interfacial SiOH bonds greatly enhance the valence band offset while interfacial SiH bonds slightly enhance the offset. The changes in the band offsets can be explained by measuring the changes in the interfacial dipoles. These results indicate that interfacial SiOH bonds can cause gate oxide deterioration in a metal-oxide-semiconductor device. It was also found that the experimentally reported hydrogen annealing effects on the barrier height cannot be explained only by termination of interfacial Si dangling bonds by H atoms or only by the creation of interfacial OH defects.
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