Abstract
AbstractIn this work, we present a systematic approach to the problems in polymer metallization. There are three main components to our study which include: assessment of the limits of metal polymer interaction, consideration of metal-metal interaction or aggregration at the interface limit, and modification of the copper surfaces to increase reactivity. All of these phenomena are assessed through application of semi-empirical electronic structure calculations with the ultimate objective being to effect a strategy for better metal deposition with the primary metal being copper. Polymer models include polyimide, epoxy resins, polyolefin ketones, and nitrile functionalized polymers. In the first component study, orbital interactions which affect adhesion are compared for a variety of polymer models and transition metals. This initial study is then extended to consider the potential for metallization by consideration of competition of metal-polymer interactions and metal-metal interactions as a metal lattice “grows” at the metal/polymer interface. Finally modification of the metal/polymer interface is assessed by considering the effect of oxidation or codeposition of dissimilar metals to augment the electronic properties and thus affinity of copper for the polymer. The general trends produced in this work are consistent with experimental measurements of adhesion and have been validated by spectral measurements. This work clearly shows the molecular level limitations of polymer-metal interactions for a series of important systems.
Published Version
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