Abstract
The study of thermal mismatch induced stresses and their role in mechanical failure is one relevant topic to composite materials, photonic devices and electronic packages. Therefore, an understanding of the nature of the interfacial stresses under different temperature conditions is necessary in order to minimize or eliminate the risk of mechanical failure. An accurate estimate of thermal stresses in the interfaces plays a significant role in the design and reliability studies of microelectronic devices. In the microelectronic industry, from a practical point of view, there is a need for simple and powerful analytical models to determine interfacial stresses in layered structures. This review paper summarizes the work conducted by the authors in relation to the bi-layered assembly with different temperature conditions on the determination of interfacial thermal stresses. The authors have extended the case of uniform temperature model by earlier researchers of two layered structure to account for differential uniform temperatures, linear temperature gradient in the layers. The presence of a heat source in one layer (die) is also presented. Finally, the effect of bond material properties and geometry on interfacial stresses and bond material selection approach are also considered in a simple way.
Highlights
An understanding of the nature of the interfacial stresses under different temperature conditions is necessary in order to minimize or eliminate the risk of mechanical failure
This review paper summarizes the work conducted by the authors in relation to the bi-layered assembly with different temperature conditions on the determination of interfacial thermal stresses
The authors have extended the case of uniform temperature model by earlier researchers of two layered structure to account for differential uniform temperatures, linear temperature gradient in the layers
Summary
Thermo-mechanical stress develops at the interface of layered structures in electronic packaging during manufacturing (Curing) and operating stages. Since there is heat flow in the materials, there will be a temperature gradient in the layers. The existence of differential uniform temperatures as well as temperature gradient in the layers should be considered while determining the shearing and peeling stresses at the interface. A generalized form of the bi-material model is required to be constructed which should be able to take care of any temperature condition in the layers. The effect of heat generation on interfacial stresses due to the presence of a heat source in a layer is needs to be investigated [17]. The authors have presented a summary of work in relation to the bi-layered assembly with different temperature conditions on the determination of interfacial thermal stresses. The effect of bond material properties and geometry on interfacial stresses and bond material selection approach are considered in a simple way
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