The total secondary electron yield of a conductive random rough surface

Abstract

One problem with current 3D printed microwave components is that they usually have more surface roughness than components manufactured with traditional machining processes. To estimate the multipactor threshold of 3D printed microwave components, it is important to evaluate the total secondary electron yield (TSEY) of the random rough surface. In this work, taking copper as an example, we conduct TSEY simulations for random rough surfaces. First, we generate both isotropic and anisotropic Gaussian type random rough surfaces; then, the dependence of the TSEY on both the roughness and correlation length is studied using Monte-Carlo simulations. Results show that when the root-mean-square roughness increases from 0 to 30 μm, the maximum TSEY increases slowly at first and then decreases rapidly. In other words, roughness can also enhance and not just suppress the TSEY. The results can be interpreted as follows: for a relatively smooth/rough surface, the TSEY enhancement/suppression induced by oblique incidence/a shadowing effect plays a dominant role. Simulation results also show that correlation length has a notable effect on the TSEY. Furthermore, for anisotropic surfaces, the azimuthal angle also influences the TSEY. Compared with currently published work, we provide an optional evaluation method for the TSEY of random rough surfaces. The predictions in this work not only confirm existing observations (the TSEY suppression effect) but also present new predictions (the TSEY enhancement effect and the azimuthal angle effect).