The thermomechanical integrity of thin films and multilayers

Abstract

Thin films and multilayers comprised of different classes of material are often used for various functional requirements. As these become relatively large in section and geometrically more complex, thermomechanical integrity is a major concern. It influences performance, yield and reliability. A methodology for thermomechanical design is needed that complements procedures used for circuit design. This article elaborates the principles of fail-safe thermomechanical design, based on the damage mechanisms known to occur in these systems. Among the important mechanisms are delamination and crazing of brittle layers. thermomechanical fatigue of metallic constituents and interface decohesion. The damage mechanisms are generally activated by residual stress, both thermal and ‘intrinsic’. The origins of these stresses are discussed, as well as stress redistribution effects that arise because of bending, discontinuities, etc. Emphasis is given to measurement methods which provide those data needed for implementation of the fail-safe design methodology.