The temperature-dependent fractional evolutional model for sintered nanoscale silver films

Abstract

The sintered nano-silver has been popularly selected as die attachment and interconnection material in the next generation of high-power electronics packaging due to its low-temperature sintering and high-temperature operation. Considering the high temperature application condition, the temperature-dependent mechanical behaviors of sintered nanoscale silver have become one of reliability concerns in high power electronics. In this article, the effect of temperature has been combined with a variable fractional model to describe the temperature-dependent mechanical behaviors. The fractional order is physically interpreted by the strain hardening index. The changing law of involved parameters with respect to temperature is also revealed by the proposed model. The model is subsequently modified with a continuously varying fractional order for the whole tensile process instead of the piecewise one. The simulation results and comparisons with existing models exhibit that the modified model presents a simpler formulation without loss of fitting accuracy.