Abstract
By merely changing the lead frame structure, high-performance QFPs (quad flat packages) were developed without any new technology. This technology makes successfully up to 304-pin QFPs. The lead frame structure is two layers for a high-speed signal and even for thermal management. The outer lead pitch is 0.5 mm. The 28-mm and 40-mm square body sizes are achieved in such a high pin count. The approach leads to low cost and high productivity and reliability. >
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