Abstract
The solder joint reliability of a 0.35-mm lead pitch, 42-mm wide/spl times/42-mm long/spl times/23-mm high, 396 pin, ceramic quad flat package (QFP) was studied in terms of: 1) finite element analysis simulation; and 2) temperature cycling tests between -65/spl deg/C and +125/spl deg/C. Using the study results, physical design of the QFP leads, in terms of thickness, standoff, and Au surface finish were optimized. If the von Mises stress of a QFP solder joint can be optimized to be no more 16.7 kilogram square millimeter, we can guarantee QFP solder joint reliability over requested design life. Also, we developed a thermocompression (T/C) soldering process for the QFP. >
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