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https://doi.org/10.1108/eb043849
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Cite Journal: Circuit World |  Publication Date: Apr 1, 1986 |
 Citations: 4 |
This paper outlines some techniques developed at GEC Research Laboratories to extend the range of specimen types which may be solderability tested by the wetting balance method. Particular emphasis is placed upon surface mounting components and substrates, which have not proved amenable to quantitative testing by conventional means.
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