Abstract
Electro-migration has become a critical reliability issue for high density solder joints in flip chip technology, especially for current crowding and joule heat. Electro-migration force and mean time to failure of flip chip are introduced in this paper. This study employs two-dimensional simulation to investigate the distribution of current density and Joule heating in the flip chip joint. It is found that current crowding and Joule heat effect are very serious in the solder bump. The Joule heat may play important role in the void formation and thermo-migration in solder bump. And the factors that impact the distribution of current density and Joule heat are studied. The results show that the thickness of Al and UBM has great influence on the distribution of current density and Joule heat.
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