Abstract
In this article, an analytical method is presented to solve the shrinkage rate and the healing history of a spherical cavity in three-dimensional piezoelectric grains under electric field, interface pressure, and internal gas pressure. From example calculations, it is seen that because of the influence of piezoelectric characteristics and electric fields, a spherical cavity in three-dimensional piezoelectric grain subjected to hydrostatic interface pressures does not completely eliminate, which is obviously consistent with some experimental observations from the micro-hole healing process. The result is useful to reveal the healing mechanism of defects in piezoelectric materials under electric and mechanical loads.
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