Abstract

We present an investigation of vertical leakage in GaN-on-Si epitaxial stack through electrical characterization and device simulations. Different structures of increasing complexity have been fabricated and analyzed in order to achieve a complete understanding of the main transport mechanisms. We have clarified the role of the Si substrate through comparison of identical structures built on p-type and n-type Si substrates. We show that in the case of p-Si substrates the leakage current is sustained by carrier generation in the Si depletion region. We also find that experiments on structures grown on n-doped silicon are consistent with considering electron injection from the substrate through the AlN/Si barrier as the main current limiting mechanism. Our insights are supported by device simulations that consistently reproduce the experimental capacitance–voltage and current–voltage characteristics as a function of temperature for all the considered structures.

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