The role of nozzle position and channel aspect ratio in thermal management of electronic modules

Abstract

In this paper, cooling of electronic modules by a series of impinging jets is studied numerically and experimentally. The study investigates the effects of nozzle position (sj/b = 0 − 0.25 − 0.5) and channel aspect ratio (H/Dj = 3 − 4 − 5) on surface temperatures, local and average heat transfer characteristics and flow dynamics. The numerical analyses are conducted using the ANSYS Fluent software, and the numerical results are verified using experimental measurements. The study's findings indicate that the displacement of the nozzles has a notable impact on the location and sizes of the vortex cells around the modules. This alteration influences the rate of convection heat transfer from the modules’ surfaces. It is concluded that increasing the channel aspect ratio leads to a reduction in convective heat transfer. The highest cooling performance is achieved in the scenario where the aspect ratio (H/Dj) is 3 and the dimensionless nozzle position (sj/b) is 0.5. However, in terms of temperature uniformity, this is H/Dj = 3 with sj/b = 0.