Abstract

A new approach to investigate light induced degradation (LID) effects in boron-doped silicon has been developed. By studying spatial variations in LID resulting from localized carrier excitation (spot-LID), it is verified that the generation of the boron-oxygen complexes responsible for the degradation is directly related to the presence of excess minority carriers. Through the examination of the diffused minority carrier density distribution (during light exposure), from an exposed into an unexposed wafer area compared to the observed defect generation, we are able to monitor the generation of excess carrier induced defects over a range of carrier concentrations. The results show that very low concentrations of minority excess carrier densities are sufficient to generate the defects. For the investigated material carrier concentrations down to 1.7 ± 0.2 × 109 cm−3 are observed to cause lifetime degradation.

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