The role of crystallographic orientation on the forces generated in ultra-precision grinding of anisotropic materials such as monocrystalline silicon

Abstract

Monitoring forces when grinding crystalline materials is advantageous for optimising process conditions, improving process control and producing high quality parts. Yet, this is challenging in precision applications where aerostatic spindles and small depths of cut are common. This work presents a system of measuring grinding forces in precision applications. Several experiments demonstrate the performance in monitoring diamond wheel dressing, detecting workpiece contact and process monitoring. The system appears promise for monitoring precision wafer.