Abstract
The reliability of outer lead bonding (OLB) joints of gold-plated tape automated bonding (TAB) leads after hot bar soldering is investigated. The consequences of thermal aging at elevated temperatures on the solid-state diffusion reactions are studied. The activation energy for the growth of the ternary CuAuSn intermetallic compound is determined to be 0.47 eV. Both aging and thermoshock treatment cause an embrittlement of the solder joint without substantially weakening the mechanical strength, even at severe test conditions. >
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Paper Title
Journal
Date
