Abstract
Diamond wire saw is the leading technology for use in slicing hard brittle material. This paper provides a brief review of its research progress in the most recent years. According to the bonding material kinds of diamond wire saw, it can be classified into three main categories, i.e. metallic bonding materials, organic bonding materials, and resin bonding materials. In the past decade, several new major technical developments in fixed abrasive diamond wire saw have emerged. This paper investigates the related literature on four different types of fixed abrasive diamond wire saws, presents their manufacturing processes and machining performance, and compares the tension and anti-abrasion of the wire saws, removal efficiency of slicing, and their applications in silicon slicing.
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