Abstract
Diamond disks are indispensable for dressing CMP pads. However, due to the poor leveling of diamond tips, only a few percents of diamond grits can penetrate the pad. As these few crystals are worn out, the plastic deformation of the pad becomes large relative to the amount of pad is cut. The polishing rate will then decline; and the scratch rate, increase. A novel technique has been developed to identify the cutting tips and their dulling process. The cutting paths become widen and shallow with more and more deformed pad material. Eventually, fewer and fewer scratch lines are present with most touching diamond pushing deformed pad around. Because there are only a handful of diamond grits that are engaged in cutting pad, the number of working crystals can increased substantially by improving the leveling of diamond tips. This improvement can increase the longevity of diamond disks that paves the way for future CMP of 18 inches wafers scheduled to make the debut in 2012.
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