Abstract
The two primary reviews were published in 1999 and 2004. Since then, there has been a dramatic evolution in device structures a nd the degree of CMP control required for their mass production. Ironically, the main classes of CMP pads remain unchanged in many respects: the most widely used CMP pad today, IC1000, was first commercialized in 1995. This review will focus on the evolutionary development of pads since then, together with a review of new research on pad responses and pad/slurry interaction mechanisms. These are the key technical factors that allow CMP pads to enable continued progress in the manufacture of advanced microelectronic devices.
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