Abstract
The process parameters affect the lapping efficiency and the surface quality of work pieces. The fixed abrasive pad of w3-5 diamond abrasive was used for lapping magnesium aluminate spinel wafers in orthogonal experiment. The affection of lapping pressure, plate speed and slurry type on material removal rate (MRR) and surface roughness Ra were investigated. Finally, the process parameters were optimized. The results showed that lapping efficiencies were higher and the surface quality was better on the conditions of Zhongjing slurry, lapping pressure 10.37Kpa and plate speed 100rpm.
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