The Microstructure of TATB‐Based Explosive Formulations During Temperature Cycling Using Ultra‐Small‐Angle X‐Ray Scattering

Abstract

AbstractTATB (1,3,5 triamino‐2,4,6‐trinitrobenzene), an extremely insensitive explosive, is used both in polymer‐bound explosives (PBXs) and as an ultra‐fine pressed powder (UFTATB). Many TATB‐based explosives, including LX‐17, a mixture of TATB and Kel‐F 800 binder, experience an irreversible expansion with temperature cycling known as ratchet growth. Additional voids, with sizes hundreds of nanometers to a few micrometers, account for much of the volume expansion. Measuring these voids is important feedback for hot‐spot theory and for determining the relationship between void size distributions and detonation properties. Also, understanding mechanisms for ratchet growth allows future choice of explosive/binder mixtures to minimize these types of changes, further extending PBX shelf life. This paper presents the void size distributions of LX‐17, UFTATB, and PBXs using commercially available Cytop M, Cytop A, and Hyflon AD60 binders during temperature cycling between −55 and 70 °C. These void size distributions are derived from ultra‐small‐angle X‐ray scattering (USAXS), a technique sensitive to structures from about 2 nm to about 2 μm. Structures with these sizes do not appreciably change in UFTATB. Compared to TATB/Kel‐F 800, Cytop M and Cytop A show relatively small increases in void volume from 0.9 to 1.3% and 0.6 to 1.1%, respectively, while Hyflon fails to prevent irreversible volume expansion (1.2–4.6%). Computational mesoscale models combined with experimental results indicate both high glass transition temperature as well as TATB binder adhesion and wetting are important to minimize ratchet growth.