Abstract

AbstractSwelling of polymer composites in solvents has become one of the major problems in the use of polymer composites exposed to petroleum products. As a possible solution to the problem, this experimental study was conducted to examine the potential application of TiB2 ceramic in butyl rubber (IIR) composites. The effect of TiB2 content on the curing kinetics of IIR composites was studied using a torque rheometer technique. The effect of TiB2 on the network structure was investigated in terms of the crosslinking density, interparticle distance between conducting particles, surface tension, glass transition temperature, degree of crystallinity, scanning electron microscopy, and X‐ray analysis. Moreover, the effect of TiB2 content on the molecular transport of solvent (kerosene) was examined by means of degree of swelling, solvent interaction parameters, volume fraction of rubber, interparticle distance after swelling, penetration rate of solvent, mean diffusion coefficient, cohesive energy density of polymer, standard entropy, standard enthalpy, and standard free energy of IIR composites. It was ascertained that with increasing TiB2 content the degree of swelling shifts to a lower value. The main reason was interpreted as the introduction of good interface adhesion of TiB2 with rubber matrix, which tends to block the diffusion of solvent molecules. The effect of TiB2 content on hardness, tensile strength, Young's modules, and elongation at break is discussed. An apparent steady‐state creep of butyl rubber IIR/TiB2 composites is evident under different constant stresses at room temperature. The strain rate of steady‐state creep showed a dependence on stress and TiB2 volume fraction. The stress sensitivity parameter, viscosity coefficient, and activation volume for samples loaded with different content of TiB2 were estimated. It is apparent that these new composites should be very useful for solvent permeation resistance at high TiB2 loading level with good mechanical properties. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 98: 2226–2235, 2005

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