Abstract
The initial stages of Cu deposition on Au(111) and Ag(111) electrodes, at underpotentials and at overpotentials, have been studied by in-situ scanning tunneling microscopy (STM). For the underpotential deposition of Cu on Au(111), the structure-determining role of anions is emphasized. In case of bulk deposition the important role of surface imperfections as nucleation centers for Cu is highlighted with the STM. In addition, the marked influence of organic additives and of the substrate material on the morphology of the Cu deposit is demonstrated.
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