Abstract
A three-dimensional numerical model using the finite element method is proposed in the present study to accurately simulate the influences of the thermal resistance on the submount of an LED. In a system with adiabatic lateral boundaries, the internal thermal resistance of the submount is principally analyzed from the series connection effect of the spreading thermal resistance and one-dimensional material resistance. However, the total thermal resistance is used for analysis under various heat dissipating conditions due to the complex coupling relations among the material resistance, the spreading thermal resistance, and the external thermal resistance. A higher contact ratio between heat source and submount, a larger external convective effect, and dissipation of heat from the symmetrical axis of the submount will decrease the spreading thermal resistance.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call