Abstract

Abstract In the present work, cold roll bonding (CRB) process characteristics of AA1050 strips, such as bond strength, threshold deformation, undulation of peeling force, and peeled surface in the presence of TiO 2 nano-particles were carried out and compared to those of aluminum strip without particles. The bond strength was evaluated by the peeling test. The results indicated that when the reduction in thickness was increased, the peeling force of AA1050 strips was enhanced. It was found that the presence of TiO 2 nano-particles reduces the bond strength of layered strips when compared to layered pure aluminum for the same reduction in thickness applied through CRB process. When the reduction in thickness was increased, the undulation of average peeling force values was increased at constant particles content. Also, the strips without particles had lower undulation value as compared to the strips with titanium oxide particles. In addition, in the presence of titanium oxide, when the particles content was increased, the undulation of average peeling force values was decreased at constant reduction in thickness. On the other hand, by increasing the particles content, the average slope of bond strength curves was decreased and the threshold deformation was increased. Finally, it was found that the bond strength of AA1100/alumina/AA1100 strips was much more than that of AA1050/titanium oxide/AA1050. This was attributed to both the metal and particle type.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.