Abstract
In this study, the bonding of CuW/Al composite was established with a Ti interlayer by vacuum hot-pressing diffusion bonding. The effects of holding time on the interfacial microstructure and mechanical properties were systematically investigated, and the interfacial microstructure was effectively optimized. The interface thickness decreased significantly to ∼11 μm, and composed of solid solution Ti (Al), CuTi and Al3Ti. The results of first-principles calculation presented that Al3Ti exhibited structural stability superior to that of CuTi due to a lower cohesive energy, and a larger number of bonding electrons in the Fermi energy level. Further, the results of low formation enthalpy revealed that Al3Ti was formed first followed by CuTi. The analysis of mechanical property showed that the interface strength of CuW/Al composite significantly improved by adding Ti interlayer with a ∼50% increase compared with that without the interlayer. The maximum shear strength reached 76.7 ± 1.6 MPa at 710 °C for specimen with holding time of 40 min. The fracture analysis demonstrated the tendency of formation of cracks within Al3Ti, which were mainly generated along the Al3Ti/Al interface.
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