Abstract

The temporal pulse train modulation during laser percussion drilling was found to effect significant changes to the material ejection processes. In particular, distinct differences in the material ejection processes have been observed between a temporal pulse train shaping technique termed as sequential pulse delivery pattern control (SPDPC) and the normal delivery pattern (NDP), wherein the parameters of successive laser pulses were constant. Due to the reduced upward material removal fractions in SPDPC drilling, the spatter deposition area was reduced from approximately 6.7 to 2.7 mm 2 . In addition, the melt layer thicknesses at the hole bottom were significantly increased from 11–61 to 18– 369 μm . Such changes were identified as being due to the low laser pulse intensities before beam breakthrough associated with the SPDPC method. It was observed that the use of the linearly increasing SPDPC method increased the downward material removal fractions, from 20% to 28% observed in NDP drilling, to 34%–39%. Such an increase in the downward material ejection mechanism in SPDPC drilling was identified as being primarily due to the pointed blind-hole profile generated before the onset of beam breakthrough. The work has shown that modulating the entire pulse train in laser percussion drilling could control the material ejection processes. Furthermore, the fundamental elements of the SPDPC technique are given in terms of the rate of energy deposition and total pulse train energy.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.