Abstract
This paper presents the microstructure and hardness of composite solders obtained by the addition of nanopowders of copper to a conventional solder. Copper powders-reinforced lead (Pb)–tin (Sn) composite solders were prepared by thoroughly blending nano-sized copper powders (average powder particle size 100 nm) with a powder of a eutectic solder and using a water-soluble flux. The blended solder paste was melted and allowed to re-solidify in a crucible placed on a hot plate and maintained at a constant temperature. Optical microscopy observations revealed the as-solidified microstructure of the composite solder to be altered by the addition of nanopowders to the eutectic Sn–Pb solder. The copper powders precipitated as intermetallic compounds that were non-uniformly distributed through the microstructure. Microhardness measurements revealed a 30–40% increase in hardness of the composite solder over the conventional unreinforced eutectic counterpart.
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