Abstract
This paper deals with the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor the junction temperature. If the sensor is not in the middle of the heat source, the recorded temperature can be quite different from the chip temperature we are mainly interested in. For the steady state temperature, it is rather easy to introduce a correction factor. For the transient behaviour of the temperature, there is a tremendous difference between the chip and the sensor temperature, which cannot be neglected if the temperature is used as a parameter to change, for example, the clock frequency in order to improve the throughput.
Highlights
Thermal management is a crucial issue in high speed data processing today
Another paper presents a compact thermal model that can be integrated with modern Computer Aided Design tools to achieve a temperature-aware design methodology [3]
The investigation proves that if the temperatures are measured both inside the microprocessor structure and outside of it, e.g., at the cooling fin, the difference between the temperatures gives very useful information
Summary
Thermal management is a crucial issue in high speed data processing today. The problem has been attacked by many authors, e.g., they propose three techniques to create sensor infrastructures for monitoring the maximum temperature of a multicore system [1]. Energies 2020, 13, 3156 thermal problems, the Alternating Current (AC) approach was very useful These studies have been applied to electronic packages cooling fins [19,20], underground underground and overhead high[15,16,17,18], voltage cables [21,22,23,24], integrated inductorsand [25],overhead heat pipeshigh [26]voltage and cables [21,22,23,24], integrated photovoltaic panels [27]. The power dissipation (and the temperature rise) consists of two a constant value and avalue variable proportional to the clocktofrequency or, in otheror,words, components:. 1) can be quite well fittedtotothe thefollowing followingfunction: function: fitted
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